Investigation and Comparison of Work Function Variation for FinFET and UTB SOI Devices Using a Voronoi Approach
In: I.E.E.E. transactions on electron devices, Jg. 60 (2013), Heft 4, S. 1485-1489
academicJournal
- print, 28 ref
Zugriff:
Using a novel Voronoi method that can provide a more realistic representation of metal-gate granularity, we investigate and compare the impact of work-function variation (WFV) on FinFET and ultrathin body (UTB) silicon-on-insulator (SOI) devices. Our study indicates that, for a given electrostatic integrity and total effective gate area, the FinFET device exhibits better immunity to WFV than its UTB SOI counterpart. We further show that, unlike other sources of random variation, the WFV cannot be suppressed by equivalent oxide thickness scaling.
Titel: |
Investigation and Comparison of Work Function Variation for FinFET and UTB SOI Devices Using a Voronoi Approach
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Autor/in / Beteiligte Person: | CHOU, Shao-Heng ; FAN, Ming-Long ; PIN, SU |
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Zeitschrift: | I.E.E.E. transactions on electron devices, Jg. 60 (2013), Heft 4, S. 1485-1489 |
Veröffentlichung: | New York, NY: Institute of Electrical and Electronics Engineers, 2013 |
Medientyp: | academicJournal |
Umfang: | print, 28 ref |
ISSN: | 0018-9383 (print) |
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