The influence of silver content on structure and properties of Sn―Bi―Ag solder and Cu/solder/Cu joints

SEBO, P ; SVEC, P ; et al.

In: Materials science & engineering. A, Structural materials : properties, microstructure and processing, Jg. 571 (2013), S. 184-192

Online academicJournal - print, 17 ref

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The effect of silver content on structure and properties of Sn100―xBi10Agx (x=3-10 at%) lead-free solder and Cu-solder-Cu joints was investigated. The microstructure of the solder in both bulk and rapidly solidified ribbon forms was analyzed by scanning electron microscopy (SEM) and X-ray diffraction. The peculiarities in melting kinetic, studied by differential scanning calorimetry (DSC), and silver influence on it are described and discussed. The wetting of a copper substrate was examined by the sessile drop method in the temperature range of 553-673 K in air and deoxidizing gas (N2+10%H2) at atmospheric pressure. Cu-solder-Cu joints were also prepared in both atmospheres, and their shear strength was measured by the push-off method. The produced solders consisted of tin, bismuth and Ag3Sn phases. The product of the interaction between the solder and the copper substrate consists of two phases: Cu3Sn, which is adjacent to the substrate, and a Cu6Sn5 phase. The wetting angle in air increased slightly as the silver concentration in the solder increased. Wetting of the copper substrate in N2+10H2 gas shows the opposite tendency: the wetting angle slightly decreased as the silver content in the solder increased. The shear strength of the joints prepared in air (using flux) tends to decrease with increasing production temperature and increasing silver content in the solder. The equivalent decrease in the shear strength of the joints prepared in N2+10H2 is more apparent.

Titel:	The influence of silver content on structure and properties of Sn―Bi―Ag solder and Cu/solder/Cu joints
Autor/in / Beteiligte Person:	SEBO, P ; SVEC, P ; JANICKOVIC, D ; ILLEKOVA, E ; ZEMANKOVA, M ; PLEVACHUK, Yu ; SIDOROV, V
Link:	View record from ScienceDirect (Volltext) View record from PASCAL Archive
Zeitschrift:	Materials science & engineering. A, Structural materials : properties, microstructure and processing, Jg. 571 (2013), S. 184-192
Veröffentlichung:	Kidlington: Elsevier, 2013
Medientyp:	academicJournal
Umfang:	print, 17 ref
ISSN:	0921-5093 (print)
Schlagwort:	Crystallography Cristallographie cristallogenèse Chemical industry parachemical industry Industrie chimique et parachimique Metallurgy, welding Métallurgie, soudage Condensed state physics Physique de l'état condensé Sciences exactes et technologie Exact sciences and technology Physique Physics Domaines interdisciplinaires: science des materiaux; rheologie Cross-disciplinary physics: materials science; rheology Science des matériaux Materials science Diagrammes de phases et microstructures développées par solidification et par transformations de phases solide-solide Phase diagrams and microstructures developed by solidification and solid-solid phase transformations Solidification Sciences appliquees Applied sciences Metaux. Metallurgie Metals. Metallurgy Assemblage et découpage thermique: aspects métallurgiques Joining, thermal cutting: metallurgical aspects Brasage Brazing. Soldering Argent Silver Plata Silber Assemblage brasage tendre Soldered joint Junta soldada Weichloetverbindung Bismuth Bismuto Bismut Calorimétrie différentielle balayage Differential scanning calorimetry Análisis calorimétrico barrido exploración Differentialrasterkalorimetrie Cinétique Kinetics Cinética Kinetik Diffraction RX X ray diffraction Difracción RX Roentgenbeugung Dépendance température Temperature dependence Effet pression Pressure effect Efecto presión Druckeinfluss Fusion Melting Fusión Schmelzen Microscopie électronique balayage Scanning electron microscopy Microscopía electrónica barrido Rasterelektronenmikroskopie Microstructure Microestructura Mikrogefuege Mouillabilité Wettability Remojabilidad Benetzbarkeit Mouillage Wetting Remojo Méthode goutte sessile Sessile drop method Método gota sésil Pression atmosphérique Atmospheric pressure Presión atmosférica Résistance cisaillement Shear strength Resistencia cizallamiento Scherfestigkeit Solidification rapide Rapid solidification Solidificación rápido Rasches Erstarren 8130F Ag3Sn Brasure sans plomb Lead free solder Cu3Sn Cu6Sn5 Substrat cuivre Cu joints Lead-free solder X-ray diffraction
Sonstiges:	Nachgewiesen in: PASCAL Archive Sprachen: English Original Material: INIST-CNRS Document Type: Article File Description: text Language: English Author Affiliations: Institute of Materials and Machine Mechanics, Slovak Academy of Sciences, Račianska 75, 831 02 Bratislava, Slovakia ; Institute of Physics, Slovak Academy of Sciences, Dúbravská cesta 9, 845 11 Bratislava, Slovakia ; Faculty of Materials Science and Technology, Slovak University of Technology, J. Bottu 25, 917 24 Trnava, Slovakia ; Ivan Franko National University, Department of Metal Physics, 79005 Lviv, Ukraine ; Ural State Pedagogical University, Cosmonavtov 26, 620017 Ekaterinburg, Russian Federation Rights: Copyright 2014 INIST-CNRS ; CC BY 4.0 ; Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS Notes: Metals. Metallurgy ; Physics and materials science

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